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第37届光掩模技术大会
作者: 发布时间:2017-07-19 阅读次数:
会议名称(中文): 第37届光掩模技术大会 

 

  会议名称(英文): The 37th Photomask Technology Conference 

  所属学科: 光学,光电子学,材料科学基础学科 

  开始日期: 2017-09-11 

  结束日期: 2017-09-14 

  所在国家: 美国 

  所在城市: 美国 

  具体地点: Monterey, California, United States 

  主办单位: 国际光学工程学会 

  联系人: Peter D. Buck 

  E-MAIL: Peter_Buck@mentor.com 

  会议网站:http://spie.org/PUV/conferencedetails/photomask-technology  

  会议背景介绍:  

  The 37th Photomask Technology Conference, organized by SPIE and BACUS (the International Photomask Technical Group of SPIE), provides a seminal international forum to present photomask technology advances and their impact on semiconductor lithography. In many ways, masks represent the confluence of the abstractness of designer intent and the physical reality of wafer lithography. Photomasks enable DUV and EUV lithography, while the closely-related master templates enable nanoimprint lithography (NIL). Consequently, SPIE Photomask has become the key venue to present technology advances on mask process, but also on OPC, data preparation, metrology, mask imaging, and mask business. The mask is a good vantage point for viewing lithography. In 2016, Chris Progler (Photronics) talked about the cost of complexity. Scaling will continue, but the added cost of complexity is also of interest to most decision-makers and adds another dimension to possible contributions for the 2017 conference. We are excited to announce that for 2017, Photomask will be collocated with the EUVL. The combined event will include four days of technical presentations and events. 

  征文范围及要求: 

  Suggested topics for Photomask submissions include, but are not limited to: Computational Lithography ·Optical Proximity Correction (OPC) ·Source/mask optimization (SMO) ·Mask imaging / mask 3D effects ·Simulation and modeling-design for manufacturability. Mask Technology ·Mask data preparation (MDP) ·Mask process correction (MPC) ·Advanced data preparation techniques ·Novel jobdeck requirements for new write formats ·Substrates and materials ·Patterning tools and processes ·Resist and resist processing and etch ·Metrology, inspection, repair ·Cleaning, contamination, and haze ·EUV mask technologies ·Equipment infrastructure ·Blank and resist ·Actinic and non-actinic characterization strategies ·Pellicles ·Multi-patterning, optical and EUV hybrid. Imaging and Emerging Mask Technologies ·Nano imprint mask making and applications ·Multi-beam mask writers ·Alternative mask technologies ·High NA-anamorphic impacts on mask- Grey-scale masks ·Direct-write, maskless lithography ·Inverse lithography and pixelated mask technology. Mask Application ·Patterned media ·Flat panel display ·MEMS patterning ·Silicon photonics. Mask Business ·Mask manufacturing management ·Mask management in wafer fabs ·Business aspects of masks ·Infrastructure challenges. Special Sessions ·Student only competing for Photronics Award and ZEISS Award. ·Panel Discussion. ·Masks for alternate lithography applications. 

  来源:SPIE  

  

 
 
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